Quality Assurance

Xi'an JIA SPEED Electronic Technology Co.,Ltd

Add: West Electronic Street, Yanta District, Xi'an City, Shaanxi Province, China

Tel: +008613186089157

Mob: +8613186089157




Base Material:fr4 Copper Thickness:1oz Board Thickness:0.2-6.0mm Min. Hole Size:0.2mm Min. Line Width:0.075mm Min. Line Spacing:0.075mm Surface Finishing:hasl solder mask:green, black,white,red,blue silkscreen:white surface treating way:HASL tolerance of hole size:0.05mm tolerance of hole position:0.05mm min. line width:0.075mm gold thickness:2-30u"

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Product Details

The Key Advantages

Higher assembly speed

High component range and flexibility

Interference free insertions

Strong mechanical bonds for durability

Ideal for heavier and bulkier components

As part of our commitment providing our customers with choice and flexibility we are happy to work with free issue material or can provide full procurement and supply chain management.

Packing design

Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to 
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments. 
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts, 
plastics, casings and print & packaging material

Quality Assurance    

Testing Methods
AOI Testing
· Checks For Solder Paste 
· Checks For Components Down To 0201" 
· Checks For Missing Components, Offset, Incorrect Parts, Polarity
X-Ray Inspection
X-Ray Provides High-Resolution Inspection Of: 
· BGAs 
· Bare Boards 
In-Circuit Testing
In-Circuit Testing Is Commonly Used In Conjunction With AOI Minimizing Functional Defects Caused By 
Component Problems. 
· Power-Up Test
· Advanced Function Test
· Flash Device Programming
· Functional Testing

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