
OEM PCB
Base Material:fr4 Copper Thickness:1oz Board Thickness:0.2-6.0mm Min. Hole Size:0.2mm Min. Line Width:0.075mm Min. Line Spacing:0.075mm Surface Finishing:hasl solder mask:green, black,white,red,blue silkscreen:white surface treating way:HASL tolerance of hole size:0.05mm tolerance of hole position:0.05mm min. line width:0.075mm gold thickness:2-30u"
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The Key Advantages
Higher assembly speed
High component range and flexibility
Interference free insertions
Strong mechanical bonds for durability
Ideal for heavier and bulkier components
As part of our commitment providing our customers with choice and flexibility we are happy to work with free issue material or can provide full procurement and supply chain management.
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
Quality Assurance
Testing Methods
AOI Testing
· Checks For Solder Paste
· Checks For Components Down To 0201"
· Checks For Missing Components, Offset, Incorrect Parts, Polarity
X-Ray Inspection
X-Ray Provides High-Resolution Inspection Of:
· BGAs
· Bare Boards
In-Circuit Testing
In-Circuit Testing Is Commonly Used In Conjunction With AOI Minimizing Functional Defects Caused By
Component Problems.
· Power-Up Test
· Advanced Function Test
· Flash Device Programming
· Functional Testing
Inquiry
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