
Metal Core PCB
Base Material: FR4, CEM-1 CEM -2 CEM -3 ,FR -1 FR -2 FR -3 Copper Thickness:0.5-7.0 oz/br> Board Thickness:0.2-7.0mm/br> Min. Hole Size:0.075mm/br> Min. Line Width:0.075mm/br> Min. Line Spacing:0.075mm/br> Surface Finishing:OSP HAL Immersion Tin/ Gold/br> Copper Thickness::0.5-7.0 oz/br> Min. Line Width::0.075mm/br> Min. Hole Size::0.075mm/br> Surface Finishing:OSP HAL Immersion Tin/ Gold/br>
Chat NowProduct Details
The main material of the printed circuit board (PCB) is a copper clad laminate, and the clad laminate (a copper clad laminate) is composed of a substrate, a copper foil, and an adhesive. The substrate is an insulating layer composed of macromolecule synthetic resin and reinforcing material; the surface of the substrate is covered with a layer of pure copper foil with high conductivity and good solderability, and the common thickness is 35-50/ma; the copper foil covers the substrate. One side of the copper clad laminate is called a single-sided copper clad laminate. The copper clad laminate on both sides of the
substrate is a double-sided copper clad laminate. If the copper foil can be firmly coated on the substrate, it is completed by an adhesive. Commonly used copper clad laminates are available in 1.0mm, 1.5mm and 2.0mm thicknesses
Production Environment
Our Service
PCB Assembly Services:
SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection
Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering
Material Sourcing
IC pre-programming / Burning on-line
Function testing as requested
Aging test for LED and Power boards
Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design
Conformal coating
Both dip-coating and vertical spray coating is available. Protecting non-conductive dielectric layer that is
applied onto the printed circuit board assembly to protect the electronic assembly from damage due to
contamination, salt spray, moisture, fungus, dust and corrosion caused by harsh or extreme environments.
When coated, it is clearly visible as a clear and shiny material.
Complete box build
Complete 'Box Build' solutions including materials management of all components, electromechanical parts,
plastics, casings and print & packaging material
Quality Assurance
Testing Methods
AOI Testing
· Checks For Solder Paste
· Checks For Components Down To 0201"
· Checks For Missing Components, Offset, Incorrect Parts, Polarity
X-Ray Inspection
X-Ray Provides High-Resolution Inspection Of:
· BGAs
· Bare Boards
In-Circuit Testing
In-Circuit Testing Is Commonly Used In Conjunction With AOI Minimizing Functional Defects Caused By
Component Problems.
· Power-Up Test
· Advanced Function Test
· Flash Device Programming
· Functional Testing
![]() |
Inquiry
- Your Name:
- *E-mail:
- Phone:
- Company:
- Title:
- *Content: