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Xi'an JIA SPEED Electronic Technology Co.,Ltd

Add: West Electronic Street, Yanta District, Xi'an City, Shaanxi Province, China

Tel: +008613186089157

Mob: +8613186089157

E-mail: 321786784@qq.com

HDI PCB

HDI PCB

Number of Layers:Multilayer
Base Material:FR-4
Copper Thickness:1oz
Board Thickness:1.6mm
Min. Hole Size:0.2mm
Min. Line Width:0.1mm(Flash Gold)/0.15mm(HASL)
Min. Line Spacing:0.1mm, 4mil
Surface Finishing:HASL, Lead Free HASL, OSP, ENIG
Product name:HDI PCB
Certificate:ROSH. ISO9001. UL
Solder mask color:Green Black Red
Material:FR4 CEM1 CEM3 Hight TG

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Product Details

HDI PCB (High Density Interconnect)

    HDI is an abbreviation of High Density Interconnector. It is a kind of technology (technical) for producing printed boards, and a circuit board with a relatively high density of wiring distribution using the micro blind buried hole technology. HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products such as touch screen computing and 4G network communications.
   HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections.

HDI circuit advantages

1. Smaller vias and traces for higher route density and fewer layers
2. Micro-via patterns for routing channels, potential for fewer layers
3. Only practical way to design with multiple large BGAs having <0.8 mm pitch
4. Lowest cost for high density boards (HDI Board)
5. HDI board for improved signal and power integrity
6. Newer materials available of higher performance and lower costs, which are not suitable for standard or sequential lamination        

characteristics:

  • Blind and/or buried vias

  • Via-in-pad

  • Through vias from surface to surface

  • 20 µm circuit geometries

  • 30 µm dielectric layers

  • 50 µm laser vias

  • 125 µm bump pitch processing

Our high density circuit boards have the technology-pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.

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