Rigid Flex PCB Print Circuit Board with Green Solder Mask Ink
1. High heat resisting property and high temperature resistance, withstand 280 Celsius Degree within 10 second,150 Celsius Degree for a long time.
2. A multilayer circuit where some of the layers are hard board and some are flexible circuitry.
3. Excellence electronic and dielectric performance.
4. The two-in-one circuit is interconnected through plated thru holes.
5. Green solder mask ink on the solder mask layer.
6. In most rigid flex circuit boards, the circuitry consists of multiple flexible circuit inner layers selectively attached together using an epoxy pre-preg bonding film, similar to a multilayer flexible circuit.
7. Provide higher component density and better quality control.
8. OSP and Immersion Nickel Gold surface treatment is done on bonding pad and plug.
9. A multilayer rigid flex circuit incorporates a board externally, internally or both as needed to accomplish the design.
10. Rigid flex circuits combine the best of both rigid boards and flexible circuits integrated together into one circuit.
11. Designs are rigid where extra support is needed and flexible around corners and areas requiring extra space.
SPECIFICATION OF STANDARD POLYIMIDE FILM BASED COVERLAY
PI Flim Thickness ( µm )
Adhesive Thickness ( µm )
SPECIFICATION OF STANDARD HALOGEN-FREE PI FILM BASED FLEXIBLE COPPER CLAD LAMINATE
( 3-LAYER FCCL )
Materials Thickness ( µm )
PI : Copper
0.5 mil : 0.5 OZ
1 mil : 0.5 OZ
1 mil : 1 OZ
2 mil : 1 OZ
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